产品详情
SK-1350 GF Thermal Gap Filler(导热凝胶)
INTRODUCTION SK-1350 GF Thermal gap filler is a two part liquid silicone-based material, curing at room temperature once mixed. SK-1350 GF is a soft and compressible material designed to dissipate heat from electronic devices such as PCB modules by conducting it to a heat sink such as an aluminum housing.
Unlike cured thermal pad materials, SK-1350 GF thermal gap filler is supplied as a two-part liquid component kits. When the liquid components are thoroughly mixed either by weight or volume, the mixture cures to a soft elastomer. These elastomers cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement. SK-1350 GF has long term perbance stability during temperature cycling up to 200℃.
SK-1350 GF thermal gap filler is used for smartphones, portable computing devices, LED lighting modules, PCB modules, communication equipment and electric vehicle parts, provide a reliable cooling solution.
Portable electronics
TYPICAL PROPERTIES
Test b：Safid Test b，which is ASTM D5470 modified. Specimen Area：DIA.25.0mm(1.0in).
HOW TO USE Mix ratio Two part，A：B=1 : 1 （by weight/volume）
STORAGE 1.Containers should be kept tighly closed and head or air space minimized.
PACKAGING
LIMITATIONS This product is neither tested nor represented as suitable for medical or pharmaceutical uses.
LIMITED WARRANTY
Blue / Two Part Silicone-based / Thermally Conductive Gap Filler
Two-part 1 : 1
Low interface stress
Optimized dispensing Thermal conductivity 3.5 W/m.K
Room temperature curing
Easy to rework
FEATURES
LED lighting modules
SSD Automotive electronics
Telecommunications
ECU BMS
TYPICAL APPLICATIONS
Test Item Data Test Item Data
Comb Silicones Hardness 40 Shore OO
Appearance A : White / B : Blue Volume Resistivity ≥1.0*1012 Ω.cm
Mix Ratio by Weight A：B=1：1 Dielectric Constant 7.0 （@1 MHz）
Specific Gravity 3.0 g/cm3 Dielectric Strength ≥10 KV （@1mm）
Viscosity @ 25℃ 150,000 cPs Use Temperature range -60 - 200℃
Thermal Conductivity 3.5 W/m.K Flammability Rating V-0
Thermal Resistance Min. （@50psi) ≤0.06 ℃ in2/W Low Volatility Content（D4-D20） ≤100 ppm
THERMAL RESISTANCE Units: ℃ in2/W
Compression 0.1mmT 0.2mmT 0.3mmT 0.5mmT 1.0mmT 1.5mmT 2.0mmT 3.0mmT 4.0mmT 5.0mmT
20 psi 0.08 0.15 0.22 0.31 0.40 0.50 0.59 0.78 0.97 1.15
50 psi 0.07 0.12 0.19 0.28 0.36 0.45 0.54 0.70 0.88 1.03
DEFLECTION VS.PRESSURE(after cure) Units: psi
Compress Rate 0.5mmT 1.0mmT 1.5mmT 2.0mmT 2.5mmT 3.0mmT 4.0mmT 5.0mmT 8.0mmT
10% 10.3 7.2 6.5 5.9 5.3 5.0 4.7 4.3 4.0
20% 40.5 21.2 16.7 13.5 12.2 9.6 8.5 7.3 5.8
30% 82.8 40.5 32.6 28.5 20.2 18.6 16.7 14.9 11.3
40% 126.4 63.6 48.8 40.6 33.3 29.2 26.7 20.5 18.9
50% 152.6 95.2 68.5 57.6 48.5 40.2 34.6 30.3 26.1
Sustain 50% 90.5 56.2 40.6 34.2 28.7 23.5 20.7 17.8 14.7
RELIABILITY
Properties Units Initial 180℃ aging 85℃/85%RH -40℃（30min）←→ 150℃（30min）
after 1000hrs after 1000hrs after 1000hrs
Thermal Conductivity W/m.k 3.51 3.62 3.55 3.59
Thermal Resistance ℃ in2/W（@1mm） 0.402 0.415 0.406 0.403
Hardness Shore OO 40 50 44 46
Volume Resistivity Ω.cm 1.3*1012 3.5*1012 2.3*1012 1.8*1012
Dielectric Strength kv（@1mm） 10.9 11.6 10.9 11.1
Thermal Resistance vs.Thinknes
DATADEFLECTION VS. PRESSURE
Test b：Safid Test b，which is ASTM D575-91 for reference.
Specimen Area：DIA.28.6mm(1.13in).
Platen Area：DIA.28.6mm(1.13in).
Sustain 50%：Sustain 50% at 1min later.
Compression Velocity：5.0mm/min.
Pot life
Cure Condition 60 min @ 25℃
8 hours @ 25℃ or 20~25 minutes @ 100℃
2.Shelf life is 6 months after the packaged date.
Available packaging size
50cc dual cartridge kit
400cc dual cartridge kit
10 gallon kit
INFORMATION The inbation contained herein is offered in good faith and is believed to be accurate. However, because conditions and bs of use of our products are beyond our control, this inbation should not be used in substitution for customer’s tests to ensure that our products are safe, effective, and fully satisfactory for the intended end use. Suggestions of use shall not be taken as inducements to infringe any patent. Safid’s sole warranty is that our products will meet the sales specifications in effect at the time of shipment.
苏州萨菲德新材料科技有限公司是一家集研发、制造、销售为一体的新型材料生产企业；
多年来，公司一直致力为客户提供全面的导热缓冲及粘接、密封、涂覆材料等解决方案；
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Safid已成为各世界著名电子企业及国内外著名新能源动力电池行业的客户优先选择；
企业宗旨：以质量求生存，靠信誉求发展；以行动履行了我们的诺言，经实践证实了我们的质量。
企业的工作理念（LRHEE）：诚信、求实、和谐、高效、创新。
企业的价值观：以高品质的产品与服务对待每一个我们忠实的客户。
联系人：方经理 联系电话：18550383598
导热凝胶:http://www.safid.com.cn
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gap filler:http://www.safid.com.cn
