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TOYO UHP-1005M3晶圆切割保护膜，新友维半导体切割厂家

数量(卷)	面议
1

供货总量：电议
最小起订： 1卷
发货地址： 15377723326
付款方式：面议
发布日期：2021-06-28
访问量：517

咨询电话：153-7772-3326

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立即询价

东莞市新友维胶粘制品有限公司

实名认证企业认证

企业地址：东莞市长安镇咸西新工业区富宁街9号

营业执照：已审核
经营模式：生产加工-私营有限责任公司
所在地区：广东东莞市
家家通积分：0分

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详细参数
品牌	tpyo	规格型号	0.105300mm100m
编号	齐全	计量单位	1卷
付款方式	面议	参考价格	电询
价格单位	人民币	供货量	不限
说明书，报价手册及驱动	暂无相关下载	其他资料下载	暂无相关下载
产地	新友维	发货地	15377723326

产品详情

晶圆切割胶带 - Pressure Sensitive Series -

Part Number :
F - 90
T - 80
T - 120
GE - 200

A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing.

High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece. Elegrip dicing tapes produced by DENKA can correspond with anti-static requirement. Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other b.

We Toyo Adtec consider needs of each user and choose appropriate tapes.

Feature

● Various product line
● standard type (AD series)
● high-perbance to difficult-to-adhere workpiece (ＧＤ series)
● excellent stability against elapsed deterioration (Ｔ series)
● high-perbance to laser-dicing (F-90)
● Easy pick-up with excellent expandability

Specification

Recommended Works	Part Number	Base Film	Color	Thickness (μm)	Adhesion Thickness (μm)	Adhesive Strength (N/20mm)	Probe Tack (N/20mm2)	Feature
Si GaAs Other Semiconductor	F-90MW	PO	MW	90	10	1	1	PVC-free type
	T-80MW	PVC		80		0.8	0.7	Excellent temporal stability
	T-80HW			80		1.7	1
	T-120HW			120		1.7	1
Thick Workpiece	20GE-200		LB	200		2.7	2.9	For thick workpiece

＊The above data is just for representing value, and not guaranteed value.
＊Static type is lined up.
＊Color : MW (Milky White) ,LB (Light Blue), T (Transparent)
＊Separator thickness is not included.

晶圆切割胶带 - UV Series -

Part Number :
UDV - 80J / UDV - 100J / UHP - 110B
UHP - 0805MC / UHP - 1005M3
UHP - 110M3 / UHP - 1025M3
UHP - 1510M3 / UHP - 1525M3
USP - 1515M4 / USP - 1515MG
UDT - 1025MC / UDT - 1325D
UDT - 1915MC

A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing.

High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece. Elegrip dicing tapes produced by DENKA are widely used for dicing and singulation of driver ICs, LTCC substrates, EMC package substrates, Si wafers, ceramics, glass, lenses and so on.

Especially UV series of Elegrip dicing tapes enable strong holding power and easy peeling without glue residue, by deactivating adhesion with UV irradiation. Elegrip dicing tapes can correspond with anti-static requirement. Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other b.

We Toyo Adtec consider needs of each user and choose appropriate tapes.

Feature

● Excellent control to back-side chipping and chip fly-off.
● Excellent adhesiveness.
● Smooth peeling by UV.
● High perbance to EMC (Epoxy Mold Compound) and other types of difficult-to-adhere workpiece.

Recommended Work I	Si GaAs Other Semi conductor
Part Number	UDV- 80J	UDV- 100J	UHP- 110B	UHP- 0805MC	UHP- 1005M3	UHP- 110M3
基材	PVC		PO
颜色	T		MW
总厚度 (μm)	80	100	110	85	105	110
黏着力 (μm)	10			5		10
Adhesive Strength (N/20mm)	3.8(0.2)	3.8(0.2)	2.9(0.2)	5.0(0.2)	5.0(0.2)	7.6(0.2)
Probe Tack (N/20mm2)	2.1(0.05)	2.1(0.05)	2.7(0.05)	1.7(0.05)	2.7(0.05)	3.9(0.05)
特性	Easy pickup			For less chipping		For small size chips

Recommended Work II	Package
Part Number	UHP-1025M3	UHP-1510M3	UHP-1525M3	USP-1515M4	USP-1515MG
基材	PO
颜色	MW
总厚度 (μm)	125	160	175	165
黏着力 (μm)	25	10	25	15
Adhesive Strength (N/20mm)	12.0(0.2)	6.5(0.2)	13.5(0.2)	14.5(0.2)	15.0(0.2)
Probe Tack (N/20mm2)	5.5(0.05)	4.2(0.05)	5.6(0.05)	6.2(0.05)	5.9(0.05)
特性	For encapsulated workpiece For less backside burrs For less glue scratch-up on the chip side walls For less against residue onto a making area

Recommended Work III	Glass Crystal
Part Number	UDT-1025MC	UDT-1325D	UDT-1915MC
基材	PET
颜色	T
总厚度 (μm)	125	155	203
黏着力 (μm)	25		15
Adhesive Strength (N/20mm)	30.0(0.2)	20.4(0.2)	20.3(0.2)
Probe Tack (N/20mm2)	7.5(0.05)	6.7(0.05)	5.9(0.05)
特性	For less backside cracking	For encapsulated workpiece	For less backside cracking

＊( ) is adhesive strength after UV.
＊The above data is just for representing value, and not guaranteed value.
＊Static type is lined up.
＊Color : MW (Milky White), T (Transparent)
＊UV irradiate condition : Light volume=above 150mJ/cm2.
＊UV irradiate condition may change with dicing products.
＊Separator thickness is not included.