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介绍————————
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 1.18 g/cc | 0.0426 lb/in3 | ISO 1183 |
| Moisture Absorption | 0.200 % | 0.200 % | 23°C / 50% RH; ISO 62 |
| Water Absorption at Saturation | 0.60 % | 0.60 % | ISO 62 |
| Linear Mold Shrinkage, Flow |
0.0040 - 0.0060 cm/cm @Thickness 3.20 mm |
0.0040 - 0.0060 in/in @Thickness 0.126 in |
SABIC Method |
| Melt Index of Compound |
23 g/10 min @Load 2.16 kg, Temperature 260 °C |
23 g/10 min @Load 4.76 lb, Temperature 500 °F |
MVR [cm^3/10 min]; ISO 1133 |
| Mechanical Properties | Metric | English | Comments |
| Tensile Strength at Break | 46.0 MPa | 6670 psi | 50 mm/min; ISO 527 |
| 47.0 MPa | 6820 psi | Type I, 50 mm/min; ASTM D638 | |
| Tensile Strength, Yield | 63.0 MPa | 9140 psi | 50 mm/min; ISO 527 |
| 63.0 MPa | 9140 psi | Type I, 50 mm/min; ASTM D638 | |
| Elongation at Break | 35 % | 35 % | 50 mm/min; ISO 527 |
| 65 % | 65 % | Type I, 50 mm/min; ASTM D638 | |
| Elongation at Yield | 4.0 % | 4.0 % | 50 mm/min; ISO 527 |
| 4.1 % | 4.1 % | Type I, 50 mm/min; ASTM D638 | |
其他型号参数与生产商——————————
PC/ABS (PC and ABS alloy) /APC-5050/ Cheng Lian Da
Usage: other
Important beters: melt flow rate: 8 g/10min notched impact strength: tensile strength: 55 MPa elongation at break: 60% bending strength: 70 MPa bending modulus: 2000 MPa thermal debation temperature: 108 C
Manufacturer: Beijing Cheng Kai Technology Co., Ltd.
PC/ABS (PC and ABS alloy) /AFPC-4555/ Cheng Lian Da
Usage: other
Important beters: melt flow rate: 25 g/10min notched impact strength: tensile strength: 55 MPa elongation at break: 20% bending strength: 65 MPa bending modulus: 2100 MPa thermal debation temperature: 108 C
Manufacturer: Beijing Cheng Kai Technology Co., Ltd.
PC/ABS (PC and ABS alloy) /FM6330/ Shanghai beauty
Application: electronic and electrical components
Important beters: melt flow rate: 8 g/10min notched impact strength: tensile strength: 52 MPa elongation at break: 35% bending strength: 63.7 MPa bending modulus: 1860 MPa
Shanghai Mei Mei Plastic Co., Ltd.
ABS/PC (ABS PC and /GP-5008BF/LG chemical # alloy)
Usage: other
Important beters: density: 1.2 g/cm3 molding shrinkage rate: 0.5% tensile strength: MPa bending strength: 82 MPa bending modulus: 2350 MPa hardness: 113 hot debation temperature: 112 C
Manufacturer: Korea LG chemical company
ABS/PC (ABS PC and /GP-5150/LG chemical # alloy)
Usage: other
Important beters: density: 1.25 g/cm3 molding shrinkage: 0.25% notched impact strength: 137 tensile strength: MPa bending strength: 147 MPa bending modulus: 4900 MPa hardness: 77 hot debation temperature: 115 C
Manufacturer: Korea LG chemical company
ABS/PC (ABS PC and /HP-5004/LG chemical # alloy)
Usage: other
Important beters: melt flow rate: 5.1 g/10min density: g/cm3 molding shrinkage: 0.5% notched impact strength: 480 tensile strength: MPa bending strength: 888 MPa bending modulus: 2220 MPa thermal debation temperature: 115
Manufacturer: Korea LG chemical company
ABS/PC (ABS PC and /LT-1A/LG chemical # alloy)
Usage: other
Important beters: density: 1.12 g/cm3 molding shrinkage: 0.5% notched impact strength: 588 tensile strength: MPa bending strength: 73.5 MPa bending modulus: 2160 MPa hardness: 112 hot debation temperature: 102 C
Manufacturer: Korea LG chemical company
ABS/PC (ABS PC /ESD C 2500/ alloy #) RTP
Usage: other
Important beters: density: 1.22 g/cm3 molding shrinkage rate: 0.4% tensile strength: MPa bending strength: 89.6 MPa bending modulus: 3100 MPa
Manufacturer: American RTP company
ABS/PC (ABS PC /2581C HEC/ RTP alloy #)
Usage: other
Important beters: density: 1.22 g/cm3 water absorption: 0.1% molding shrinkage rate: 0.2% tensile strength: MPa bending strength: 124 MPa bending modulus: 5520 MPa thermal debation temperature: 121 C
Manufacturer: American RTP company
ABS/PC (ABS PC /2582 HEC FR/ alloy #) RTP
Usage: other
Important beters: density: 1.39 g/cm3 molding shrinkage rate: 0.05% tensile strength: MPa bending strength: 138 MPa bending modulus: 6890 MPa
Manufacturer: American RTP company
