产品详情
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LOAD LOCK Chamber (option) LOAD LOCK预真空进样室（可选） Chamber with front open door 前开门蒸发腔体 Cryopump and dry pump 冷凝泵和干泵 Multiple thermal evaporation sources or OLED sources 多个热阻蒸发源或OLED低温蒸发源 Max. 6” substrate 6”基片 Substrate rotation 基片旋转 Substrate bias (option) 基片偏压（可选） Ion source for substrate cleaning (option) 离子源清洗基片（可选） Substrate heating to 1000C (option) 基片加热1000度(可选) Crystal rate monitor and film thickness control 晶振沉积速率及膜厚控制 Manual or automatic system control 系统手动或自动控制 For deb of bl, semiconductor and insulation materials 可沉积金属、半导体和绝缘材料 For deb of multi-layer or alloy film |
可沉积多层膜及合金薄膜
